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iMAPS Device Packaging Conference (Virtual)

When:
April 12, 2021 – April 15, 2021 all-day America/Chicago Timezone
2021-04-12T00:00:00-04:00
2021-04-16T00:00:00-04:00
Where:
Virtual Event

The 17th International Conference on Packaging – A Global Virtual Event

The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

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