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iMAPS Device Packaging Conference (DPC 2019)

March 4, 2019 – March 7, 2019 all-day America/Chicago Timezone
WekoPa Resort and Casino
10438 N Fort McDowell Rd
Fort McDowell, AZ 85264

The 15th Annual Device Packaging Conference (DPC 2019)

It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). Featuring 4 Topical Tracks: 3D Applications & Technologies; Flip Chip, Wafer Level Packaging & Fan-Out; Engineered Micro Systems/Devices (including MEMS, Sensors & 3D Printing); and AUTOMOTIVE PACKAGING (new track in 2019!).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.


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