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2020 IWLPC – International Wafer-Level Packaging Conference

When:
October 13, 2020 – October 15, 2020 all-day America/Chicago Timezone
2020-10-13T00:00:00-07:00
2020-10-16T00:00:00-07:00
Where:
DoubleTree by Hilton Hotel
2050 Gateway Pl
San Jose, CA 95110
USA

October 13 – 15, 2020
DoubleTree by Hilton San Jose
San Jose, California, USA

IWLPC is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology featuring 3 tracks in WLP, 3D Integration, and Advanced Manufacturing and Test. This year is a continuation of Bridging the Boundaries: Wafer, Panel and Beyond reflecting the enablement of 5G communications, AI, and IoT, automotive and more.

Addressing Concerns Related to Coronavirus (COVID-19) and Status of the Conference

The health and safety of our participants and members is top priority. We remain in regular contact with our venue managers, speakers, and professionals within the greater meeting planning industry. We are carefully monitoring current developments and are assessing the situation on a case-by-case basis. Currently, IWLPC will proceed as planned unless noted otherwise. We will inform you about any changes immediately.

Details & Registration

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