PCIM Asia Shenzhen Conference 2026
PCIM Asia Shenzhen Conference 2026 launches seven exclusive oral sessions, gathering global industrial experts and academic teams. The topics cover WBG semiconductors, high-efficiency converters, power electronic AI, packaging reliability, automotive motor drives and smart grid technologies, spanning the full technical chain from chip design and intelligent algorithms to industrial applications.
We welcome R&D engineers, academic researchers and technical managers to join the event and promote industry-wide technological innovation.
Date: August 26–28, 2026
Venue: Shenzhen World Exhibition & Convention Center (Bao’an New Hall)
